Pay Range:   $25/hr to $27/hr, the pay rate may differ depending on your skills, education, experience, and other qualifications.

Featured Benefits:

• Medical Insurance in compliance with the ACA
• 401(k)
• Sick leave in compliance with applicable state, federal, and local laws

Job Description

100% onsite role

Laptop will be issued.

• The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
• Minimum qualification is an AA degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development
• Knowledge of packaging material property and behavior is beneficial.
• Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized.

Preferred skills:

Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM imaging on printed circuit board are preferred.